Re Ring Auto Handler
Features
- Wafer / Ring-Frame 합착
Specification
| Item | Description |
|---|---|
| Function | Re-Ring Auto Handler |
| Lo/Unloading | Loading : 각 100 매 Unloading : 100 매 |
| Stage | 2 Stage |
| Wafer Align Method | Camera Vision |
| Air Supply | 4~6kg/㎤ |
| Power | 220V |
| Dimension | W1,964 x D2.020x H2,320 (Tower Lamp 별도) |
| Weight | About 1,500kg |
Die Series
Ring Detach Auto Handler
Die Series
Re Ring Auto Handler
Die Series
Die Detach Auto Handler
Die Series
Die Tester
Die Series