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Semiconductor
Die Detach Auto Handler



Die Detach Auto Handler
Die Detach Auto Handler
Die Detach Auto Handler
Features
- DIE DETACH MC
Specification
Item | Description |
---|---|
Function | Die Detach on Wafer |
Cassette | 3 x 10 slot |
Stage | 2 Stage |
Die Maping Method | Camera Vision |
Air Supply | 5~7kg/㎤ |
Weight | About 3,500kg |
Dimension | W2,900 x D1,900 x H2,000 |
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